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1

Influence of Temperature on Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals

Yanaka, Yuichi, Kariya, Yoshiharu, Watanabe, Hirohiko, Hokazono, Hiroaki

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 2.68 MB

english, 2018

2

Evaluation of creep properties for Sn–Ag–Cu micro solder joint by multi-temperature stress relaxation test

Yoshihiko Kanda, Yoshiharu Kariya

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 802 KB

english, 2012

3

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Temperature dependence of fatigue crack propagation rate of pressureless sintered Ag nanoparticles

Kimura, Ryo, Kariya, Yoshiharu, Mizumura, Noritsuka, Sasaki, Koji

Year:

2017

Language:

english

File:

PDF, 194 KB

english, 2017

4

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Study on low-cycle fatigue testing and therrmal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, Kazuki, Yajima, Naoyuki, Kariya, Yoshiharu, Hiroshima, Yoshiyuki, Kikuchi, Shunichi, Matsui, Akiko, Shimizu, Hiroshi

Year:

2017

Language:

english

File:

PDF, 194 KB

english, 2017

5

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

Watanabe, Kazuki, Kariya, Yoshiharu, Yajima, Naoyuki, Obinata, Kizuku, Hiroshima, Yoshiyuki, Kikuchi, Shunichi, Matsui, Akiko, Shimizu, Hiroshi

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.78 MB

english, 2018

6

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - High Temperature Fatigue Crack Propagation Characteristics of Pressureless Sintered Silver Nanoparticles

Osaki, Koji, Kariya, Yoshiharu, Mizumura, Noritsuka, Sasaki, Koji

Year:

2019

Language:

english

File:

PDF, 202 KB

english, 2019

7

Effect of silver content on the shear fatigue properties of Sn-Ag-Cu flip-chip interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahisa Otsuka

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 579 KB

english, 2004

8

Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

Yoshihiko Kanda, Yoshiharu Kariya, Yuji Oto

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 608 KB

english, 2012

9

Tin pest in Sn-0.5 wt.% Cu lead-free solder

Yoshiharu Kariya, Naomi Williams, Colin Gagg, William Plumbridge

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2001

Language:

english

File:

PDF, 1.66 MB

english, 2001

10

Low-cycle fatigue properties of eutectic solders at high temperatures

YOSHIHARU KARIYA, TADATOMO SUGA

Journal:

Fatigue & Fracture of Engineering Materials & Structures

Year:

2007

Language:

english

File:

PDF, 437 KB

english, 2007

11

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen

Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa

Year:

2005

Language:

english

File:

PDF, 701 KB

english, 2005

12

Tin pest in lead‐free solders

Kariya, Yoshiharu, Gagg, Colin, Plumbridge, William J.

Journal:

Soldering & Surface Mount Technology

Year:

2001

Language:

english

File:

PDF, 332 KB

english, 2001

13

Low-Cycle Fatigue Life and Fatigue Crack Propagation of Sintered Ag Nanoparticles

Shioda, Ryutaro, Kariya, Yoshiharu, Mizumura, Noritsuka, Sasaki, Koji

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.09 MB

english, 2016

14

Influence of Crystallographic Orientation on Fatigue Reliability of ^|^beta;-Sn and ^|^beta;-Sn Micro-Joint

Kariya, Yoshiharu, Tajima, Sho, Yamada, Saori

Journal:

MATERIALS TRANSACTIONS

Year:

2012

Language:

english

File:

PDF, 604 KB

english, 2012

15

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Deformation Behavior of Pressurized Sintered Ag Nanoparticles in Discrete Type Power Semiconductor Device

Nagata, Kiichi, Kariya, Yoshiharu, Horie, Shoji

Year:

2019

Language:

english

File:

PDF, 703 KB

english, 2019

16

Assessment of low-cycle fatigue life of Sn-3.5mass%Ag-X (X=Bi or Cu) alloy by strain range partitioning approach

Yoshiharu Kariya, Tomoo Morihata, Eisaku Hazawa, Masahisa Otsuka

Journal:

Journal of Electronic Materials

Year:

2001

Language:

english

File:

PDF, 1.48 MB

english, 2001

17

The constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept

Yoshiharu Kariya, Masahisa Otsuka, William J. Plumbridge

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 96 KB

english, 2003

18

Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects

Shinichi Terashima, Yoshiharu Kariya, Takuya Hosoi, Masamoto Tanaka

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 206 KB

english, 2003

19

Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

Yoshihiko Kanda, Yoshiharu Kariya

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 937 KB

english, 2010

20

Effect of bismuth on the isothermal fatigue properties of Sn-3.5mass%Ag solder alloy

Yoshiharu Kariya, Masahisa Otsuka

Journal:

Journal of Electronic Materials

Year:

1998

Language:

english

File:

PDF, 604 KB

english, 1998

21

Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

Yoshiharu Kariya, Masahisa Otsuka

Journal:

Journal of Electronic Materials

Year:

1998

Language:

english

File:

PDF, 218 KB

english, 1998

22

Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints

Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka

Journal:

Journal of Electronic Materials

Year:

1999

Language:

english

File:

PDF, 473 KB

english, 1999

23

[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Fujita, Mitsuru, Anzai, Nobuhiro, Sakamaki, Kazutoshi, Kariya, Yoshiharu

Year:

2013

Language:

english

File:

PDF, 534 KB

english, 2013

24

[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - Effect of Ni Addition on Bending Properties of Sn-Ag-Cu Lead-Free Solder Joints

Kobayashi, Takayuki, Kariya, Yoshiharu, Sasaki, Tsutomu, Tanaka, Masamoto, Tatsumi, Kohei

Year:

2007

Language:

english

File:

PDF, 2.22 MB

english, 2007

25

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Kariya, Yoshiharu, Sato, Kana, Asari, Shota, Kanda, Yoshihiko

Year:

2010

Language:

english

File:

PDF, 926 KB

english, 2010

26

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Kanda, Yoshihiko, Zama, Kunihiro, Kariya, Yoshiharu, Oota, Hironori, Kikuchi, Shunichi, Yamabe, Hideki, Nakamura, Kazuhiko

Year:

2010

Language:

english

File:

PDF, 1.16 MB

english, 2010

27

SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - Mechanical properties of lead-free solder alloys evaluated by miniature size specimen

Kariya, Yoshiharu, Asai, Tsuyoshi, Suga, Tadatomo, Lopez, Jose F., Quan, Chenggen, Chau, Fook Siong, Fernandez, Francisco V., Lopez-Villegas, Jose Maria, Asundi, Anand, Wong, Brian Stephen, de la Rosa

Year:

2012

Language:

english

File:

PDF, 568 KB

english, 2012

28

Development of New Imaging System for Chest Radiography: Investigation of Basic Imaging Properties and Improvement of Signal Detection

Higashida, Yoshiharu, Kariya, Kohmyo

Journal:

Japanese Journal of Applied Physics

Year:

1991

Language:

english

File:

PDF, 485 KB

english, 1991

29

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 1 - Visco-Elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package

Kanda, Yoshihiko, Zama, Kunihiro, Kariya, Yoshiharu, Mikami, Takao, Kobayashi, Takaya, Sato, Toshiyuki, Enomoto, Toshiaki, Hirata, Koichi

Year:

2009

Language:

english

File:

PDF, 354 KB

english, 2009

30

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy

Sato, Takuma, Kariya, Yoshiharu, Fukui, Kazuma

Year:

2013

Language:

english

File:

PDF, 1.82 MB

english, 2013

31

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Higher thermal cycling reliability of power semiconductor module for power converters

Morozumi, Akira, Hokazono, H., Nishimura, Yoshitaka, Kariya, Yoshiharu, Mochizuki, Eiji, Takahashi, Yoshikazu

Year:

2016

Language:

english

File:

PDF, 1.16 MB

english, 2016

32

Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

Shohji, Ikuo, Osawa, Tsutomu, Matsuki, Takashige, Kariya, Yoshiharu, Yasuda, Kiyokazu, Takemoto, Tadashi

Journal:

MATERIALS TRANSACTIONS

Year:

2008

Language:

english

File:

PDF, 277 KB

english, 2008

33

Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn^|^ndash;Ag^|^ndash;Cu Joints

Kanda, Yoshihiko, Kariya, Yoshiharu, Tasaka, Takeshi

Journal:

MATERIALS TRANSACTIONS

Year:

2012

Language:

english

File:

PDF, 1.99 MB

english, 2012

34

Effect of Strain Rate and Temperature on Micro Fatigue Crack Propagation of Bi-Sn Eutectic Alloy

Taniguchi, Maiko, Kariya, Yoshiharu

Journal:

MATERIALS TRANSACTIONS

Year:

2016

Language:

english

File:

PDF, 1.96 MB

english, 2016

35

Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint

Kanda, Yoshihiko, Kariya, Yoshiharu, Mochizuki, Yusuke

Journal:

MATERIALS TRANSACTIONS

Year:

2008

Language:

english

File:

PDF, 363 KB

english, 2008

36

Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials

Kariya, Yoshiharu, Shohji, Ikuo

Journal:

MATERIALS TRANSACTIONS

Year:

2016

Language:

english

File:

PDF, 19 KB

english, 2016

37

Plastic Deformation Behavior and Mechanism of Bismuth Single Crystals in Principal Axes

Yanaka, Yuichi, Kariya, Yoshiharu, Watanabe, Hirohiko, Hokazono, Hiroaki

Journal:

MATERIALS TRANSACTIONS

Year:

2016

Language:

english

File:

PDF, 1.74 MB

english, 2016

38

Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint

Kariya, Yoshiharu, Kanda, Yoshihiko, Iguchi, Keitaro, Furusawa, Hiromitsu

Journal:

MATERIALS TRANSACTIONS

Year:

2010

Language:

english

File:

PDF, 2.04 MB

english, 2010

39

Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects

Kariya, Yoshiharu, Hosoi, Takuya, Kimura, Takashi, Terashima, Shinichi, Tanaka, Masamoto

Journal:

MATERIALS TRANSACTIONS

Year:

2004

Language:

english

File:

PDF, 471 KB

english, 2004

40

Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition

Terashima, Shinichi, Kariya, Yoshiharu, Tanaka, Masamoto

Journal:

MATERIALS TRANSACTIONS

Year:

2004

Language:

english

File:

PDF, 994 KB

english, 2004

41

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 561 KB

english, 2005

42

Thermal Fatigue Life Evaluation of Epoxy Resin/Si Joint under Mineral Oil Condition

Takahashi, Hideto, Kariya, Yoshiharu

Journal:

MATERIALS TRANSACTIONS

Year:

2016

Language:

english

File:

PDF, 476 KB

english, 2016

43

[ASME ASME 2003 International Electronic Packaging Technical Conference and Exhibition - Maui, Hawaii, USA (July 6–11, 2003)] 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1 - Isothermal Shear Fatigue Life of Sn-xAg-0.5Cu Flip Chip Interconnects

Kariya, Yoshiharu, Hosoi, Takuya, Terashima, Shinichi, Tanaka, Masamoto, Otsuka, Masahisa

Year:

2003

Language:

english

File:

PDF, 555 KB

english, 2003

44

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Kontani, Hiroyuki, Kariya, Yoshiharu, Fumikura, Tomoya

Year:

2013

Language:

english

File:

PDF, 2.50 MB

english, 2013

45

Effect of Sintering Temperature on Fatigue Crack Propagation Rate of Sintered Ag Nanoparticles

Kimura, Ryo, Kariya, Yoshiharu, Mizumura, Noritsuka, Sasaki, Koji

Journal:

MATERIALS TRANSACTIONS

Year:

2018

Language:

english

File:

PDF, 5.30 MB

english, 2018

46

Infrared Emission Spectra of a Thin Film of Molten Alkali-metal Nitrates.

Maeda, Masafumi, Kariya, Yoshiharu

Journal:

ISIJ International

Year:

1993

Language:

english

File:

PDF, 683 KB

english, 1993

47

Infrared Emission Spectra of CaF2-CaO-SiO2 Melt.

Ueda, Shigeru, Koyo, Hirotaka, Ikeda, Takashi, Kariya, Yoshiharu, Maeda, Masafumi

Journal:

ISIJ International

Year:

2000

Language:

english

File:

PDF, 142 KB

english, 2000

48

Mechanical Behavior of Sintered Nano-sized Ag Particles

KARIYA, Yoshiharu, YAMAGUCHI, Hideaki, ITAKO, Masahiro, MIZUMURA, Noritsuka, SASAKI, Koji

Journal:

Journal of Smart Processing

Year:

2013

Language:

english

File:

PDF, 962 KB

english, 2013

49

Infrared Emission Spectra of CaF2-CaO-SiO2 Melt.

Ueda, Shigeru, Koyo, Hirotaka, Ikeda, Takashi, Kariya, Yoshiharu, Maeda, Masafumi

Journal:

ISIJ International

Year:

2000

File:

PDF, 142 KB

2000

50

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Cure Shrinkage Behavior Analysis in Ultraviolet Curable Adhesive using Finite Element Method

Sato, Yuga, Kariya, Yoshiharu

Year:

2019

File:

PDF, 273 KB

2019

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